Low latency ADC/DAC FMC

  Erik Barhorst     28-06-2019     Reacties (0)

Teledyne e2v and Logic-X are collaborating on the design and development of an FPGA mezzanine card (FMC) that incorporates two of the latest Converter chips from Teledyne e2v Alphen a/d Rijn, the Netherlands, June 28 2019 – Logic-X, a provider of high-quality sensor processing products that solve its customer’ embedded and edge processing challenges, and Teledyne e2v today announced they work together to deliver commercial off the shelf products that are designed and manufactured in Europe based on the Teledyne e2v digital-to-analog (DAC) and analog-to-digital (ADC) devices. Teledyne e2v and Logic-X are collaborating on the design and development of an FPGA mezzanine card (FMC) that incorporates two of the latest Converter chips from Teledyne e2v. Those are the EV12DS460A and the EV12AS350B. The EV12DS460A is a...

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Adaptable compute acceleration platforms and Sensor interface products

  Erik Barhorst     17-05-2019     Reacties (0)

Adaptable compute acceleration platforms and Sensor interface products Over the years the industry has continued to explore the different options of addressing the ever-increasing need for high performance computing in sensor processing and artificial intelligence applications. Many of these applications require more than a standard CPU to perform the complex algorithms and growing amount of data to be processed. This has given rise to platforms that form a combination of traditional CPUs collaborating with vector processing units like GP GPUs and DSP processors. However, these platforms run into scaling challenges due to inefficiency of the memory bandwidth usage. Also, the GPU/DSP platforms require a relatively large amount of power for their processing. One of the solutions for both problems have been traditional FPGA platforms, which offer highly configurable programmable logic with massive...

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